Standard PCB Technics Capacity
With 15 years of PCB manufacturing experience, HHSD provides customers with high-quality PCB and low-cost FR4 PCB manufacturing.
According to the PCB equipment and PCB production conditions, PCB process basis, management level, and the PCB production process level of the HHSD, HHSD is customized as the basis for the HHSD to purchase orders, contract review, and engineering design.
For more information on Standard PCB technics capacity, click Download Process Capability DataSheet to download the documentation. Please contact us if you have questions.
Standard PCB
Halogen-Free PCB(HF PCB)
Printed wire board
Maximum layers of FR-4 PCB: 108 layers
Maximum production size: 2000 * 650mm (the size decreases after the number of layers increases), Can manufacture standard PCB board, HDI buried hole and blind hole PCB, multi-material mixed pressure PCB, high-frequency board, Rigid-flex PCB.
We use lines and solder resist direct imaging (LDI) for more precise control of lines High multi-layer PCB board and laser perforation direct plating blind hole filling, better PCB flatness. Use character printing to make the silk screen clearer.
Our PCB Research and Manufacturing Goals for the Next 2 Years
1. Advanced pulse plating, raising the high thickness diameter ratio to 48:1 or higher
2. The impedance control tolerance is reduced to ± 5% or more
3. The line width and line spacing shall be reduced to 25 / 25um
4. Continuously verify new PCB materials for high-order HDI PCB, high-speed low loss PCB, IC substrate and thinner and more precise applications
5. Research on deep micropores (thickness diameter ratio 1:1 or greater)
6. Research on metal core plate, conductive paste (Ormet and Tatsuta), copper paste plug hole technology
7. Process research of buried component PCB, such as buried capacity PCB, buried resistance PCB and buried magnetic PCB
Standard PCB Technics Capacity
Item | Description | DataSheet
|
Dielectric Constant (at 1 MHz) | Layer | 1-108 |
Materia | Brand | SY, ITEQ, KB, NanYa, Doosan, Isola, TUC, EMC, Ventec |
Surface treatment | HASL lead-free,Immersion Gold, OSP, Immersion Tin, Immersion Silver,
Plating Gold, Plating Tin, ENEPIG | |
Selectivity surface treatment | ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion
Tin+G/F | |
Solder mask color | Green, Yellow, Black, Matte black, Blue, Red, White,Matte green | |
Silkscreen color | White, Yellow, Black | |
Max board size with 2L | mm | 2000*650mm |
Max board size with 4L,6L | mm | 570*850mm or 1150*430mm(Exceeding 570mm shall be reviewed) |
Max board size with more than 8L | mm | 570*670mm or 980*430mm(Exceeding 570mm shall be reviewed) |
Min board size | mm | 0.5*1.0mm(thickness≤0.5mm), 1.0*2.0mm(thickness≥0.5mm) |
Min outline tolerance | mm | ±0.05mm(Laser Routing), ±0.1mm(Mechanical Routing) |
PCB Board Thickness | mm | 0.13-8mm |
Double side board thickness | mm | 0.13-3.6mm |
4Layers board thickness | mm | 0.30-7mm |