Leveraging extensive experience and in-depth expertise, HHSD consistently delivers high-quality and reliable BGA PCB assembly services to its customers.
Our comprehensive BGA assembly services encompass BGA prototype development, PCB assembly, component removal, replacement, rework, reballing, and inspection. By offering these extensive services, we enable customers to streamline their supply chains and expedite product development timelines.
To ensure the highest quality in BGA assembly, we employ multiple inspection techniques, such as optical, mechanical, and X-ray inspections. Notably, X-ray inspection is essential for assessing BGA solder joints. This method allows the X-rays to penetrate components to evaluate the solder joints underneath, examining aspects such as position, radius, and thickness of the solder joints.
BGA PCB layout enables efficient utilization of available space, allowing for the mounting of more components on the board and the production of lighter devices.
In BGA technology, heat produced by components is directly transferred through the balls. Additionally, the extensive contact area enhances heat dissipation, preventing component overheating and promoting longer component lifespan.
The short distance between the die and the circuit board enhances electrical conductivity. Additionally, the absence of through-holes on the board, which is covered with solder balls and other components, minimizes vacant spaces.
BGA simplifies assembly and management compared to other PCB assembly techniques, as it utilizes solder balls to directly attach the package to the board.
We employ solid solder balls in the manufacture of BGA leads, reducing the risk of damage during operation.
BGA Types: | µBGA, CTBGA, CABGA, CVBGA, VFBGA, LGA,etc. |
Number of Layers: | Up to 40 layers |
Solder balls: | Lead & lead-free |
Pitch Size: | Minimum pitch sizes 0.4mm; Placement accuracy +/- 0.03 mm |
Passive Footprints: | 0201, 01005, POP, 0603, and 0402 |
BGA Assembly Size: | 1x1mm to 50x50mm |
Board Thickness: | 0.2mm-7mm |
Certifications: | ISO9001, IS014001, ISO13485, RoHS, IPC, etc. |
We adhere strictly to the ISO quality management system, ensuring that all our processes meet the highest quality standards for BGA PCB assembly.
HHSD has the capability to assemble a wide range of BGA components, from small to large sizes, including fine-pitch BGA.
Our BGA assembly team consists of professional engineers and IPC-trained personnel who provide technical support throughout the process, ensuring high reliability.
+86 01082749250
info@hhsdtechnology.com
F4, Building A, Hongfu Science Park, Changping District, Beijing, China.